| 外观 | 制造商零件编号 | 制造商 | 描述 | 封装/外壳 | 包装 | ROHS |
|---|---|---|---|---|---|---|
|
LCP02-150M |
STMicroelectronics | IC PROTECTION SLIC POWERSO-10 | PowerSO-10 裸露底部焊盘 | 管件 |
|
|
|
LCP02-150M-TR |
STMicroelectronics | IC PROTECTION SLIC POWERSO-10 | PowerSO-10 裸露底部焊盘 | 带卷 (TR) |
|
|
PCLT-2AT4 |
STMicroelectronics | IC OVP DGTL TERMINATION 14-TSSOP | 14-TSSOP （0.173"，4.40mm 宽）裸露焊盘 | 管件 |
|
|
|
PCLT-2AT4-TR |
STMicroelectronics | IC OVP DGTL TERMINATION 14-TSSOP | 14-TSSOP （0.173"，4.40mm 宽）裸露焊盘 | 带卷 (TR) |
|
|
|
SPT01-335DEE |
STMicroelectronics | IC OVP FOR 24V PROX SENSOR 6-QFN | 6-VQFN 裸露焊盘 | 带卷 (TR) |
|
|
SSRP105B1RL |
STMicroelectronics | IC OVP DUAL ASYMM TELECOM 8-SOIC | 8-SOIC（0.154"，3.90mm 宽） | 带卷 (TR) |
|
|
|
THDT6511DRL |
STMicroelectronics | TVS SLIC PROTECTION ASD 8-SOIC | 8-SOIC（0.154"，3.90mm 宽） | 带卷 (TR) |
|
|
TLP140G-1 |
STMicroelectronics | IC OVP TRIPOLAR TELECOM I2PAK | TO-262-3，长引线，I?Pak，TO-262AA | 管件 |
|
|
TLP140G |
STMicroelectronics | IC OVP TRIPOLAR TELECOM D2PAK | TO-263-3，D?Pak（2 引线+接片），TO-263AB | 管件 |
|
|
|
TLP200G-1 |
STMicroelectronics | IC OVP TRIPOLAR TELECOM I2PAK | TO-262-3，长引线，I?Pak，TO-262AA | 管件 |
|
|
|
TLP200G |
STMicroelectronics | IC OVP TRIPOLAR TELECOM D2PAK | TO-263-3，D?Pak（2 引线+接片），TO-263AB | 管件 |
|
|
|
TLP270G-1 |
STMicroelectronics | IC OVP TRIPOLAR TELECOM I2PAK | TO-262-3，长引线，I?Pak，TO-262AA | 管件 |
|
|
|
TSI220B1RL |
STMicroelectronics | IC INTERFACE PROT DIO BRDG 8SOIC | 8-SOIC（0.154"，3.90mm 宽） | 带卷 (TR) |
|
|
|
CLP30-200B1RL |
STMicroelectronics | IC OVP/OCP TELECOM 8-SOIC | 8-SOIC（0.154"，3.90mm 宽） | Digi-Reel? |
|
|
|
STBP110CVDJ6F |
STMicroelectronics | IC OVP PROTECTION POWERFLAT2X2 | 8-WFDFN 裸露焊盘 | Digi-Reel? |
|