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外观 制造商零件编号 制造商 描述 封装/外壳 包装 ROHS
STM802BDR

STM802BDR

STMicroelectronics IC SOLENOID CONTROLLER 8-SOIC 8-SOIC(0.154",3.90mm 宽) 带卷 (TR)
STV0674T100

STV0674T100

STMicroelectronics IC PROCSR CAM CMOS DGITL 100TQFP 100-LQFP 管件
STV0976

STV0976

STMicroelectronics IC COPROCESSOR DGTL SMIA 56TFBGA - -
SY58626LMH TR

SY58626LMH TR

- IC TRANSMITTER 6.4GBPS 32-MLF - -
SY58627LMG

SY58627LMG

- IC BUFF REC 6.4GBPS 32MLF - -
TDA 6190T GEG

TDA 6190T GEG

- IC MIXER/AMP DVB-IF PDSO-16 16-SOIC(0.154",3.90mm 宽)12 引线 带卷 (TR) -
TLE8261-2E

TLE8261-2E

- IC SYSTEM BASIS CHIP DSO-36 36-BSSOP(0.295",7.50mm 宽)裸露焊盘 带卷 (TR)
TLE8261E

TLE8261E

- IC SYSTEM BASIS CHIP DSO-36 36-BSSOP(0.295",7.50mm 宽)裸露焊盘 带卷 (TR)
TLE8262-2E

TLE8262-2E

- IC SYSTEM BASIS CHIP DSO-36 36-BSSOP(0.295",7.50mm 宽)裸露焊盘 带卷 (TR)
TLE8262E

TLE8262E

- IC SYSTEM BASIS CHIP DSO-36 36-BSSOP(0.295",7.50mm 宽)裸露焊盘 带卷 (TR)
TLE8263-2E

TLE8263-2E

- IC SYSTEM BASIS CHIP DSO-36 36-BSSOP(0.295",7.50mm 宽)裸露焊盘 带卷 (TR)
TLE8263E

TLE8263E

- IC SYSTEM BASIS CHIP DSO-36 36-BSSOP(0.295",7.50mm 宽)裸露焊盘 带卷 (TR)
TLE8264-2E

TLE8264-2E

- IC SYSTEM BASIS CHIP DSO-36 36-BSSOP(0.295",7.50mm 宽)裸露焊盘 带卷 (TR)
TLE8264E

TLE8264E

- IC SYSTEM BASIS CHIP DSO-36 36-BSSOP(0.295",7.50mm 宽)裸露焊盘 带卷 (TR)
TRAC020LHQ36

TRAC020LHQ36

- IC TRAC ANA 5V 5MA 20CELL 36QSOP 36-BSOP(0.295",7.50mm 宽) 散装 -