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外观 制造商零件编号 制造商 描述 封装/外壳 包装 ROHS
0067007702

0067007702

Laird Technologies EMI 垫圈与接地垫 L 16 xW .191xH .065 COMPACT ... - - -
BMIC-006

BMIC-006

Laird Technologies EMI 垫圈与接地垫 0.10 BeCu Tin 2 x 2 - - -
HZ0603A182R-10

HZ0603A182R-10

Laird Technologies EMI/RFI 抑制器及铁氧体 1800ohms 1.5ohms 50mA - - -
4184-PA-51H-01800

4184-PA-51H-01800

Laird Technologies EMI 垫圈与接地垫 FoF D Shape L18 x H 0.6 x W0.15 - - -
02257

02257

Laird Technologies EMI 垫圈与接地垫 Srfce Wv Fire Rtrdnt 24 L x 2... - - -
02272

02272

Laird Technologies EMI 垫圈与接地垫 Srfce Wv Fire Rtrdnt 24 L x 2... - - -
4742AB51K01800

4742AB51K01800

Laird Technologies EMI 垫圈与接地垫 EMI Gasket - - -
CM5441Z101B-13

CM5441Z101B-13

Laird Technologies Common Mode Inductors (Chokes) 100ohms 0.0008o... - - -
4701-PA-51H-01800

4701-PA-51H-01800

Laird Technologies EMI 垫圈与接地垫 FoF Rectangular L 18 xW .375 ... - - -
4633AF51K01080

4633AF51K01080

Laird Technologies EMI 垫圈与接地垫 GK NiCu NRA PU V0 BELL - - -
4233AB51K08400

4233AB51K08400

Laird Technologies EMI 垫圈与接地垫 GK,NiCu,NRS,PU,V0 Rec .600x1.... - - -
BMIS-206-C

BMIS-206-C

Laird Technologies EMI 垫圈与接地垫 BMIS-206 Cover 1.450 x1.326 - - -
BMIC-007-01

BMIC-007-01

Laird Technologies EMI 垫圈与接地垫 0.10 BeCu Tin 1.5 x 2.12 - - -
0097091502

0097091502

Laird Technologies EMI 垫圈与接地垫 L 15 xW .45 xH .14 SOLID TOP... - - -
BMIS-203-C

BMIS-203-C

Laird Technologies EMI 垫圈与接地垫 BMIS-203 Cover 1.032 x1.032 - - -