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外观 制造商零件编号 制造商 描述 封装/外壳 包装 ROHS
BA4425F-E2

BA4425F-E2

ROHM Semiconductor IC FM/TV FRONT END SOP8 TR 8-SOIC(0.173",4.40mm 宽) 带卷 (TR)
BGM 781N11 E6327

BGM 781N11 E6327

- MODULE GPS FRONT-END TSNP-11-2 10-WFDFN 裸露焊盘 带卷 (TR)
BGM 681L11 E6327

BGM 681L11 E6327

- IC GPS FRONT-END 3.6V TSLP11-1 10-UFDFN 裸露焊盘 带卷 (TR)
CC1190RGVR

CC1190RGVR

Texas Instruments IC RF FRONT-END 16VQFN 16-VQFN 裸露焊盘 带卷 (TR)
CC2590RGVRG4

CC2590RGVRG4

Texas Instruments IC RF FRONT END 2.4GHZ 16-QFN 16-VQFN 裸露焊盘 带卷 (TR)
CC2590RGVTG4

CC2590RGVTG4

Texas Instruments IC RF FRONT END 2.4GHZ 16-QFN 16-VQFN 裸露焊盘 带卷 (TR)
CC2591RGVRG4

CC2591RGVRG4

Texas Instruments IC RF FRONT END 2.4GHZ 16-QFN 16-VQFN 裸露焊盘 带卷 (TR)
CC2591RGVTG4

CC2591RGVTG4

Texas Instruments IC RF FRONT END 2.4GHZ 16-QFN 16-VQFN 裸露焊盘 带卷 (TR)
HPA00420RGVR

HPA00420RGVR

Texas Instruments IC RF FRONT END 2.4GHZ 16VQFN 16-VQFN 裸露焊盘 带卷 (TR)
LX5551LQTR

LX5551LQTR

- IC WIRELESS LAN PA 16-MLPQ 16-MLPQ 带卷 (TR)
LX5552LUTR

LX5552LUTR

- IC WIRELESS LAN PA 16-MLPQ 16-MLPQ 带卷 (TR)
MAX2670GTB+T

MAX2670GTB+T

- IC AMP GPS/GNSS FRONTEND 10TDFN 10-WFDFN 裸露焊盘 带卷 (TR)
MAX2742ECM+D

MAX2742ECM+D

- IC GPS RF FRONT END 48TQFP 48-TQFP 裸露焊盘 托盘
MAX2742ECM+TD

MAX2742ECM+TD

- IC GPS RF FRONT END 48TQFP 48-TQFP 裸露焊盘 带卷 (TR)
MAX2745ECM+D

MAX2745ECM+D

- IC GPS RF FRONT END 48TQFP 48-TQFP 裸露焊盘 托盘