| 描述 | IC H-BRIDGE 5A CURR FDBK 20-HSOP | 评估套件 | 可供 |
|---|---|---|---|
| 输出数 | 1 | 电流 - 输出 | 5A |
| 电压 - 负载 | - | 电源电压 | 5 V ~ 28 V |
| 工作温度 | -40°C ~ 125°C | 安装类型 | 表面贴装 |
| 封装/外壳 | 20-SOIC（0.433"，11.00mm 宽）裸露焊盘 | 供应商设备封装 | 20-HSOP |
| 包装 | 带卷 (TR) | 配用 | KIT33887PNBEVB-ND - KIT EVAL 33887 5A H-BRIDGE PQFNKIT33887DWBEVB-ND - KIT EVAL 33887 5A H-BRIDGE SOIC |
【Freescale Semiconductor】MC33887DWB,IC H-BRIDGE 5.0A W/CS 54-SOIC
【Freescale Semiconductor】MC33887DWBR2,IC H-BRIDGE 5A LOAD FDBK 54-SOIC
【Freescale Semiconductor】MC33887PEK,IC H-BRIDGE CURR FDBK 5A 54SOICW
【Freescale Semiconductor】MC33887PEKR2,IC H-BRIDGE CURR FDBK 5A 54SOICW
【Freescale Semiconductor】MC33887PFK,IC H-BRIDGE CURR FDBK 5A 36PQFN
【Freescale Semiconductor】MC33887PFKR2,IC H-BRIDGE CURR FDBK 5A 36PQFN
【Freescale Semiconductor】MC33887PNB,IC H-BRIDGE CURR FDBK 5A 36-PQFN
【Freescale Semiconductor】MC33887PNBR2,IC H-BRIDGE 5A CURR FDBK 36-PQFN