| 描述 | 钽质电容器-固体SMD 33uF 20volts 10% D cs ESR 0.35 Molded | 容差 | 10 % |
|---|---|---|---|
| 封装 / 箱体 | 7343-31 metric | 制造商库存号 | D Case |
| 尺寸 | 4.3 mm W x 7.3 mm L | 高度 | 2.8 mm |
| 工作温度范围 | - 55 C to + 85 C | 系列 | TF3 |
| 产品 | Tantalum Solid Low ESR Standard Grade | 封装 | Reel |
| 损耗因数 DF | 6 | 端接类型 | SMD/SMT |
TF3D475K035C0700,钽质电容器-固体SMD 4.7uF 35volts 10% D cs ESR 0.7 Molded
TF3D476K6R3C0450,钽质电容器-固体SMD 47uF 6.3volts 10% D cs ESR 0.45 Molded
TF3D685K035C1300,钽质电容器-固体SMD 6.8uF 35volts 10% D cs ESR 1.3 Molded
TF3D685K050C0900,钽质电容器-固体SMD 6.8uF 50volts 10% D cs ESR 0.9 Molded
TF3D686K010C0800,钽质电容器-固体SMD 68uF 10volts 10% D cs ESR 0.8 Molded
TF3D686K016C0300,钽质电容器-固体SMD 68uF 16volts 10% D cs ESR 0.3 Molded
TF3E106K035C0500,钽质电容器-固体SMD 10uF 35volts 10% E cs ESR 0.5 Molded
TF3E106K035C1000,钽质电容器-固体SMD 10uF 35volts 10% E case ESR 1 Molded