| 描述 | 钽质电容器-固体SMD 10uF 3V@175C 10% B case ESR 1.8 Molded | 容差 | 10 % |
|---|---|---|---|
| 封装 / 箱体 | 3528-21 metric | 制造商库存号 | E Case |
| 尺寸 | 2.8 mm W x 3.5 mm L | 高度 | 1.9 mm |
| 工作温度范围 | - 55 C to + 175 C | 系列 | TH4 |
| 产品 | Tantalum Solid High Temperature | 封装 | Reel |
| 损耗因数 DF | 6 | 漏泄电流 | 0.6 uAmps |
| 纹波电流 | 0.22 Amps | 端接类型 | SMD/SMT |
TH4B226K010C1600,钽质电容器-固体SMD 22uF 5V@175C 10% B case ESR 1.6 Molded
TH4B226K016C1900,钽质电容器-固体SMD 22uF 8V@175C 10% B case ESR 1.9 Molded
TH4B226K6R3C1500,钽质电容器-固体SMD 22uF 3V@175C 10% B case ESR 1.5 Molded
TH4C226K010C1400,钽质电容器-固体SMD 22uF 5V@175C 10% C case ESR 1.4 Molded
TH4C226K016C1400,钽质电容器-固体SMD 22uF 8V@175C 10% C case ESR 1.4 Molded
TH4C476K010C0500,钽质电容器-固体SMD 47uF 5V@175C 10% C case ESR 0.5 Molded
TH4C476K016C0800,钽质电容器-固体SMD 47uF 8V@175C 10% C case ESR 0.8 Molded
TH4C476K6R3C0800,钽质电容器-固体SMD 47uF 3V@175C 10% C case ESR 0.8 Molded