按厂商分类
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ASHLING MICROSYSTEMS(ASHLING MICROSYSTEMS,ASHLING MICROSYSTEMS)(4)
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Bluetechnix(Bluetechnix,Bluetechnix)(1)
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BRENDES(BRENDES,BRENDES)(1)
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DIGILENT(DIGILENT,DIGILENT)(4)
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EMBEST(EMBEST,EMBEST)(2)
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Freescale Semiconductor(Freescale Semiconductor,Freescale Semiconductor)(4)
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Infineon(Infineon,Infineon)(1)
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LEAP ELECTRONIC(LEAP ELECTRONIC,LEAP ELECTRONIC)(1)
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Microchip(Microchip,Microchip)(17)
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NEC(NEC,NEC)(1)
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Ramtron(Ramtron,Ramtron)(1)
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SEEDDSP(SEEDDSP,SEEDDSP)(5)
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SOFTBAUGH(SOFTBAUGH,SOFTBAUGH)(1)
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STMicroelectronics(STMicroelectronics,STMicroelectronics)(1)
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Texas Instruments(Texas Instruments,Texas Instruments)(6)
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外观
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制造商零件编号
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制造商
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描述
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封装/外壳
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包装
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ROHS
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Ramtron
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