| 外观 | 制造商零件编号 | 制造商 | 描述 | 封装/外壳 | 包装 | ROHS |
|---|---|---|---|---|---|---|
|
MC33886DHR2 |
Freescale Semiconductor | IC H-BRIDGE 5.0A 20-HSOP | 20-SOIC（0.433"，11.00mm 宽）裸露焊盘 | 带卷 (TR) |
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|
MC33886PVW |
Freescale Semiconductor | IC H-BRIDGE 5.0A OUTPUT 20HSOP | 20-SOIC（0.433"，11.00mm 宽）裸露焊盘 | 管件 |
|
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|
MC33886PVWR2 |
Freescale Semiconductor | IC H-BRIDGE 5.0A OUTPUT 20HSOP | 20-SOIC（0.433"，11.00mm 宽）裸露焊盘 | 带卷 (TR) |
|
|
MC33886VW |
Freescale Semiconductor | IC H-BRIDGE 5.0A OUTPUT 20-HSOP | 20-SOIC（0.433"，11.00mm 宽）裸露焊盘 | 管件 |
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|
MC33886VWR2 |
Freescale Semiconductor | IC H-BRIDGE 5.0A 20-HSOP | 20-SOIC（0.433"，11.00mm 宽）裸露焊盘 | 带卷 (TR) |
|
|
|
MC33887APVW |
Freescale Semiconductor | IC H-BRIDGE LOAD CURR FB 20HSOP | 20-SOIC（0.433"，11.00mm 宽）裸露焊盘 | 管件 |
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|
MC33887APVWR2 |
Freescale Semiconductor | IC H-BRIDGE LOAD CURR FB 20HSOP | 20-SOIC（0.433"，11.00mm 宽）裸露焊盘 | 带卷 (TR) |
|
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|
MC33887AVW |
Freescale Semiconductor | IC H-BRIDGE LOAD CURR FB 20-HSOP | 20-SOIC（0.433"，11.00mm 宽）裸露焊盘 | 管件 |
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|
MC33887AVWR2 |
Freescale Semiconductor | IC H-BRIDGE LOAD CURR FB 20-HSOP | 20-SOIC（0.433"，11.00mm 宽）裸露焊盘 | 带卷 (TR) |
|
|
|
MC33887DH |
Freescale Semiconductor | IC H-BRIDGE 5.0A W/CS 20-HSOP | 20-SOIC（0.433"，11.00mm 宽）裸露焊盘 | 管件 |
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MC33887DHR2 |
Freescale Semiconductor | IC H-BRIDGE 5A CURR FDBK 20-HSOP | 20-SOIC（0.433"，11.00mm 宽）裸露焊盘 | 带卷 (TR) |
|
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|
MC33887DWB |
Freescale Semiconductor | IC H-BRIDGE 5.0A W/CS 54-SOIC | 54-BSSOP（0.295"，7.50mm 宽）裸露焊盘 | 管件 | - |
|
|
MC33887DWBR2 |
Freescale Semiconductor | IC H-BRIDGE 5A LOAD FDBK 54-SOIC | 54-BSSOP（0.295"，7.50mm 宽）裸露焊盘 | 带卷 (TR) | - |
|
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MC33887PEK |
Freescale Semiconductor | IC H-BRIDGE CURR FDBK 5A 54SOICW | 54-SSOP（0.295"，7.50mm 宽）裸露焊盘 | 管件 |
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MC33887PEKR2 |
Freescale Semiconductor | IC H-BRIDGE CURR FDBK 5A 54SOICW | 54-SSOP（0.295"，7.50mm 宽）裸露焊盘 | 带卷 (TR) |
|