| 描述 | 集管和线壳 2.5 W/W PANEL MOUNT W/W PANEL MOUNT HSG | 节距 | 2.5 mm |
|---|---|---|---|
| 位置/触点数量 | 10 | 排数 | 1 |
| 安装风格 | Through Hole | 外壳材料 | Polyester |
| 封装 | Bag | 工厂包装数量 | 500 |
| 端接类型 | Solder Pin | 零件号别名 | 0511981000 |
【Molex】51198-1100,集管和线壳 2.5 W/W PANEL MOUNT W/W PANEL MOUNT HSG
【Molex】51198-1200,集管和线壳 2.5 W/W PANEL MOUNT W/W PANEL MOUNT HSG
【Molex】51198-1300,集管和线壳 2.5 W/W PANEL MOUNT W/W PANEL MOUNT HSG
【Molex】51198-1400,集管和线壳 2.5 W/W PANEL MOUNT W/W PANEL MOUNT HSG
【Molex】51198-1500,集管和线壳 2.5 W/W PANEL MOUNT W/W PANEL MOUNT HSG
【Wakefield】511-9M,Heatsinks HIGH FIN DENSITY H/S 5.21 X 9.00"
