| 描述 | 钽质电容器-固体SMD 22uF 6.3volts 10% C cs ESR 0.6 Molded | 容差 | 10 % |
|---|---|---|---|
| 封装 / 箱体 | 6032-28 metric | 制造商库存号 | C Case |
| 尺寸 | 3.2 mm W x 6 mm L | 高度 | 2.5 mm |
| 工作温度范围 | - 55 C to + 85 C | 系列 | TF3 |
| 产品 | Tantalum Solid Low ESR Standard Grade | 封装 | Reel |
| 损耗因数 DF | 6 | 端接类型 | SMD/SMT |
TF3C475K025C1000,钽质电容器-固体SMD 4.7uF 25volts 10% C case ESR 1 Molded
TF3D107K010C0400,钽质电容器-固体SMD 100uF 10volts 10% D cs ESR 0.4 Molded
TF3D156K035C0500,钽质电容器-固体SMD 15uF 35volts 10% D cs ESR 0.5 Molded
TF3D226K020C0350,钽质电容器-固体SMD 22uF 20volts 10% D cs ESR 0.35 Molded
TF3D226K020C1000,钽质电容器-固体SMD 22uF 20volts 10% D case ESR 1 Molded
TF3D226K025C0400,钽质电容器-固体SMD 22uF 25volts 10% D cs ESR 0.4 Molded
TF3D226K025C0800,钽质电容器-固体SMD 22uF 25volts 10% D cs ESR 0.8 Molded
TF3D336K020C0350,钽质电容器-固体SMD 33uF 20volts 10% D cs ESR 0.35 Molded